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datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. rrr040p03 pch -30v -4a power mosfet outline v dss 30v r ds(on) (max.) 45m i d 4a p d 1w features inner circuit 1) low on - resistance. 2) built-in g-s protection diode. 3) small surface mount package (tsmt3). 4) pb-free lead plating ; rohs compliant packaging specifications type packaging taping application reel size (mm) 180 dc/dc converters tape width (mm) 8 basic ordering unit (pcs) 3,000 drain - source voltage v dss 30 v taping code tl marking ug absolute maximum ratings (t a = 25c) parameter symbol value unit continuous drain current i d *1 4 a pulsed drain current i d,pulse *2 16 a power dissipation gate - source voltage v gss 20 v p d *3 1.0 w p d *4 0.54 w junction temperature t j 150 c range of storage temperature t stg 55 to 150 c (1) (2) (3) tsmt3 (1) gate (2) source (3) drain ? 1 esd protection diode ? 2 body diode 1/11 2012.05 - rev.b 2016.06 - rev.b fra 5) aec-q101 qualified downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 *1 limited only by maximum temperature allowed. *2 pw 10 s, duty cycle 1% *3 mounted on a ceramic boad (30300.8mm) *4 mounted on a fr4 (12200.8mm) thermal resistance parameter symbol values unit min. typ. max. thermal resistance, junction - ambient r thja *4 - - 231 c/w thermal resistance, junction - ambient r thja *3 - - 125 c/w electrical characteristics (t a = 25c) parameter symbol conditions values unit min. typ. max. v breakdown voltage temperature coefficient v (br)dss t j i d = 1ma referenced to 25c - 25 - mv/c drain - source breakdown voltage v (br)dss v gs = 0v, i d = 1ma 30 - - a gate - source leakage current i gss v gs = 20v, v ds = 0v - - 10 a zero gate voltage drain current i dss v ds = 30v, v gs = 0v - - 1 v gate threshold voltage temperature coefficient v (gs)th t j i d = 1ma referenced to 25c - 3.9 - mv/c gate threshold voltage v gs (th) v ds = 10v, i d = 1ma 1 - 2.5 static drain - source on - state resistance r ds(on) *5 v gs = 10v, i d = 4a - 32 45 - 47 66 m v gs = 4.5v, i d = 2a - 45 63 v gs = 4.0v, i d = 2a - 52 72 v gs = 10v, i d = 4a, t j =125c transconductance g fs *5 v ds = 10v, i d = 4a 2.7 7.2 - s gate input resistannce r g f = 1mhz, open drain - 13 - 2/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 *5 pulsed electrical characteristics (t a = 25c) parameter symbol conditions values unit min. typ. max. pf output capacitance c oss v ds = 10v - 150 - reverse transfer capacitance c rss f = 1mhz input capacitance c iss v gs = 0v - 1000 - - 130 - unit min. typ. max. turn - on delay time t d(on) *5 v dd c 15v, v gs = 10v - 15 - ns rise time t r *5 i d = 2a - 30 - turn - off delay time t d(off) *5 r l = 7.5 - 85 - fall time v dd c 15v, i d = 4a v gs = 10v v dd c 15v, i d = 4a v gs = 5v - 10.5 - total gate charge q g *5 - gate charge characteristics (t a = 25c) parameter symbol conditions values t f *5 r g = 10 - 45 max. - 3.0 - gate - drain charge q gd *5 - 3.3 - body diode electrical characteristics (source-drain)(t a = 25c) parameter symbol conditions values unit min. typ. nc v dd c 15v, i d = 4a v gs = 10v - 20 40 gate - source charge q gs *5 a forward voltage v sd *5 v gs = 0v, i s = 4a - - 1.2 v inverse diode continuous, forward current i s *1 t a = 25c - - 0.8 3/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves 0.1 1 10 100 1000 10000 0.0001 0.01 1 100 t a =25oc single pulse 0.01 0.1 1 10 100 0.1 1 10 100 p w = 100 s dc operation t a =25oc single pulse mounted on a ceramic board. (30mm ?b 30mm ?b 0.8mm) operation in this area is limited by r ds (on) (v gs = 10v) p w = 10ms p w = 1ms 0 20 40 60 80 100 120 05 01 0 01 5 0 200 fig.1 power dissipati on derating curve power dissipation : p d /p d max. [%] junction temperature : tj [ r c] fig.2 maximum safe operating area drain current : -i d [a] drain - source voltage : -v ds [v] fig.3 normalized transient thermal resistance vs. pulse width normalized transient thermal resistance : r (t) pulse width : p w [s] fig.4 single pulse maxmum power dissipation pulse width : p w [s] peak transient power : p(w) 0.001 0.01 0.1 1 10 0.0001 0.01 1 100 t a =25oc single pulse rth(ch -a)=62.5oc/w rth(ch -a)(t)=r(t) ?b rth(ch-a) mounted on ceramic board. (30mm ?b 30mm ?b 0.8mm) top d=1 d=0.5 d=0.1 d=0.05 d=0.01 bottom signle 4/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.5 typical output characteristics(i) drain current : -i d [a] drain - source voltage : -v ds [v] fig.6 typical output characteristics(ii) drain current : -i d [a] drain - source voltage : -v ds [v] 0 1 2 3 4 0 0.2 0.4 0.6 0.8 1 v gs = 2.5v t a =25oc pulsed v gs = 10v v gs = 4.5v v gs = 4.0v v gs = 2.8v 0 1 2 3 4 02468 10 v gs =-2.5v t a =25oc pulsed v gs = 2.5v v gs = 2.8v v gs = 10v v gs = 4.5v v gs = 4.0v v gs = 3.0v 5/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves 0 20 40 60 -50 0 50 100 150 v gs = 0v i d = 1ma pulsed 0 1 2 3 -50 05 01 0 0 150 v ds = 10v i d = 1ma pulsed fig.7 breakdown voltage >>> vs. junction temperature drain - source breakdown voltage : -v (br)dss [v] junction temperature : t j [ r c ] fig.8 typical transfer characteristics gate - source voltage : -v gs [v] fig.9 gate threshold voltage vs. junction temperature gate threshold voltage : -v gs(th) [v] junction temperature : t j [ r c ] fig.10 transconductan ce vs. drain current transconductance : g fs [s] drain current : -i d [a] drain current : -i d [a] 0.001 0.01 0.1 1 10 100 0123 4 v ds = 10v pulsed t a = 125oc t a = 75oc t a = 25oc t a = 25oc 0.1 1 10 0.01 0.1 1 10 v ds = 10v pulsed t a = 25oc t a =25oc t a =75oc t a =125oc 6/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.11 drain currentderating curve drain current dissipation : i d /i d max. (%) junction temperature : t j [oc] fig.13 static drain - source on - state resistance vs. drain current(i) static drain - sourc e on-state resistance : r ds(on) [m ] junction temperature : t j [oc] fig.14 static drain - source on - state resistance vs. j unction temperature static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] fig.12 static drain - source on - state resistance vs. gate source voltage static drain - sourc e on-state resistance : r ds(on) [m ] gate - source voltage : -v gs [v] 0 50 100 150 051 0 15 t a =25oc pulsed i d = 4.0a i d = 2.0a 10 100 1000 0.1 1 10 t a =25oc pulsed v gs = 4.0v v gs = 4.5v v gs = 10v 0 0.2 0.4 0.6 0.8 1 1.2 -25 0 25 50 75 100 125 150 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 v gs = 10v i d = 4.0a pulsed 7/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.16 static drain - source on - state resistance vs. drain current(iii) static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] fig.15 static drain - source on - state resistance vs. drain current(ii) static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] fig.17 static drain - source on - state resistance vs. drain current(iv) static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] 10 100 1000 0.1 1 10 v gs = 10v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 10 100 1000 0.1 1 10 v gs = 4.5v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 10 100 1000 0.1 1 10 v gs = 4.0v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 8/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.18 typical capacitance >>>>> vs. drain - source voltage capacitance : c [pf] drain - source voltage : -v ds [v] fig.20 dynamic input characteristics gate - source voltage : -v gs [v] total gate charge : q g [nc] fig.19 switching characteristics switching time : t [ns] drain current : -i d [a] fig.21 source current >>>>> vs. source drain voltage source current : -i s [a] source-drain voltage : -v sd [v] 10 100 1000 10000 0.01 0.1 1 10 100 t a =25oc f=1mhz v gs =0v ciss coss crss 1 10 100 1000 10000 0.01 0.1 1 10 t a =25oc v dd = 15v v gs = 10v r g =10 pulsed t f t d(on) t d(off) t r 0 2 4 6 8 051 0 15 t a =25oc v dd = 15v i d = 4.0a r g =10 pulsed 0.01 0.1 1 10 0 0.5 1 1.5 v gs =0v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 9/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 measurement circuits fig.1-1 switching time measurement circuit fig.1-2 f switching waveforms fig.2-1 gate charg e measurement circuit fig.2-2 gate charge waveform 10/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 dimensions (unit : mm) dimension in mm/inches tsmt3 patterm of terminal osition areas >e >? >? >?? >?>y >>? ? > >>y >>t >? > ?>t ?>y >y ? ?>y >? ? ? ?$ >? > >>?> >>? >>?> >>? > > >y>>> > >>>>?>? >>y >>>> >>>y> > >>>>> >>t >>>?> >>>?> >>>>? >>>>?>? >>? ? >>>?> >>>> >>>>y> >>>>t ? >>>y> >>>t>a >>>>> >>>>y >e >t>>?> >?>>> >>>y>y >>>y>y>? >? >y>>> >y>>?> >>>>>? >>>>?>y ? >? >? >t>>a> >?>>> >>>y>>t >>>y>y>? >?>y >>>?> >>>a> >>>>y>t >>>>t> >?? >>>> >>>?> >>>>y>a >>>>t>? >y >>>> >>>t> >>>>>t >>>>y ?$ > >>>t> > >>>>>? >>?> >>? >>?> >>? ?>y ?>t >>>?> > >>>>t>? ?>y > >>>?> > >>>>?> >>>t> >>>>y >e>?> >>?>?>?>>??>?>t>? >?>>?>?>?>? >t>>y> >>>>? >e>?> >>?>?>?>>??>?>t>? >?>>?>?>?>? >>>?> >>>> 11/11 2012.05 - rev.b ra 2016.06 - rev.b downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///

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